MODIC™ M603 tie layer Co-extrusion PE types Adhesive resin Mitsubishi Chemical in stock

Brands:Mitsubishi

Varieties:TIE

All items are available from stock.Feel free to contact customer service or call us for other product models.

Product:Modic M603

Product Name:TIE-resin

Common Name:Adhesive resin
Origin:Japan

Brand:Mitsubishi Chemical

Trademark:Modic™

Telephone: 18114636617 Ms.Wang

Telephone: 18114639927 Mr.Luo

E-mail :lili0032@outlook.com

List price：￥0.00

Price：￥0.00

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Ordinary：￥0.00

VIP：￥0.00

Weight：0.000KG

Product parameters

Brands:Mitsubishi
Varieties:TIE

Description

All items are available from stock.Feel free to contact customer service or call us for other product models.

Product:Modic M603

Product Name:TIE-resin

Common Name:Adhesive resin
Origin:Japan

Brand:Mitsubishi Chemical

Trademark:Modic™

Telephone: 18114636617 Ms.Wang

Telephone: 18114639927 Mr.Luo

E-mail :lili0032@outlook.com

Mitsubishi Chemical MODIC™ M603 tie-layer Co-extrusion PE types Adhesive resin in stock

MODIC™ M603 is a base resin of LLDPE.Combined extruded resin: PE / M603 / EVOH, PE / M603 / Polyamide.

MODIC™ - ACID-GRAFTED POLYMER(TIE RESIN)

MODIC™ tie-layer resin is acid grafted polyolefin forming a layer or a coating which provides adhesion between materials that have poor affinity. Formulations are adapted to PE, PP, EVOH, PA, PS, PET, PBT, PC, metal and glass.

A unique tie-layer resin offering excellent adhesive performance to a variety of materials, covering various applications and requirements for automotive, food/non-food packaging, industry and building/construction.

May be used for:

Multi-layer sheet
Pipe Coating
Film (cast film, blown film)
Blow molding (bottles, containers)
Adhesive promoter for injected or extruded multi-material parts
Extrusion coating and lamination
Coupling agent / compatiblizer (plastic with glass and natural fiber)

Since MODIC™ is a polyolefin-based adhesive polymer, it maintains polyolefin-like characteristics including: mechanical strength, thermal properties, chemical resistance and easy-processing in numerous multi-layer applications.